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OPA656-DIEwww.
ti.
comSBOS596–MARCH2012WIDEBAND,UNITY-GAINSTABLE,FET-INPUTOPERATIONALAMPLIFIERCheckforSamples:OPA656-DIE1FEATURESUnity-GainBandwidthAPPLICATIONSLowInputBiasCurrentWidebandPhotodiodeAmplifiersLowOffsetandDriftSample-and-HoldBuffersLowDLCCDOutputBuffersHighOutputCurrentADCInputBuffersLowInputVoltageNoiseWidebandPrecisionAmplifiersTestandMeasurementFrontEndsDESCRIPTIONTheOPA656combinesaverywideband,unity-gainstable,voltage-feedbackopampwithaFET-inputstagetoofferanultrahighdynamic-rangeamplifierforADC(analog-to-digitalconverter)bufferingandtransimpedanceapplications.
ExtremelylowDCerrorsgivegoodprecisioninopticalapplications.
Thehighunity-gainstablebandwidthandJFETinputallowsexceptionalperformanceinhigh-speed,low-noiseintegrators.
ORDERINGINFORMATION(1)PACKAGEPRODUCTPACKAGE(2)ORDERABLEPARTNUMBERPACKAGEQUANTITYDESIGNATOROPA656TDB1400OPA656TDBaredieinwafflepackOPA656TDB210(1)Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTIwebsiteatwww.
ti.
com.
(2)ProcessingispertheTexasInstrumentscommercialproductionbaselineandisincompliancewiththeTexasInstrumentsQualityControlSystemineffectatthetimeofmanufacture.
ElectricalscreeningconsistsofDCparametricandfunctionaltestingatroomtemperatureonly.
UnlessotherwisespecifiedbyTexasInstrumentsACperformanceandperformanceovertemperatureisnotwarranted.
VisualInspectionisperformedinaccordancewithMIL-STD-883TestMethod2010ConditionBat75Xminimum.
1Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
PRODUCTIONDATAinformationiscurrentasofpublicationdate.
Copyright2012,TexasInstrumentsIncorporatedProductsconformtospecificationsperthetermsoftheTexasInstrumentsstandardwarranty.
Productionprocessingdoesnotnecessarilyincludetestingofallparameters.
OPA656-DIESBOS596–MARCH2012www.
ti.
comThisintegratedcircuitcanbedamagedbyESD.
TexasInstrumentsrecommendsthatallintegratedcircuitsbehandledwithappropriateprecautions.
Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.
Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
BAREDIEINFORMATIONBACKSIDEBONDPADBONDPADDIETHICKNESSBACKSIDEFINISHPOTENTIALMETALLIZATIONCOMPOSITIONTHICKNESS15mils.
SiliconwithbackgrindVS-TiW/AlCu(0.
5%)1100nmTable1.
BondPadCoordinatesinMicrons(1)DESCRIPTIONPADNUMBERXMINYMINXMAXYMAXInvertingInput127623127723NonInvertingInput22753127153N/C318153281153Output472327823127VS-5723337823439VS+6723649823749N/C7181623281723(1)SubstrateisVS-.
2SubmitDocumentationFeedbackCopyright2012,TexasInstrumentsIncorporatedProductFolderLink(s):OPA656-DIEPACKAGEOPTIONADDENDUMwww.
ti.
com7-Apr-2012Addendum-Page1PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)Samples(RequiresLogin)OPA656TDB1ACTIVE0400TBDCallTIN/AforPkgTypeOPA656TDB2ACTIVE010TBDCallTIN/AforPkgType(1)Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.
Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.
Samplesmayormaynotbeavailable.
OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.
ti.
com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.
TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.
1%byweightinhomogeneousmaterials.
Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.
ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.
1%byweightinhomogeneousmaterial)(3)MSL,PeakTemp.
--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.
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