279.25www.kknnn.com

TLV4112-DIEwww.
ti.
comSGLS411–NOVEMBER2012HIGH-OUTPUT-DRIVEOPERATIONALAMPLIFIERWITHSHUTDOWN1FEATURESHighOutputDriveRail-To-RailOutputUniversalOperationalAmplifierEVMDESCRIPTIONTheTLV4112single-supplyoperationalamplifierprovidesoutputcurrentsinexcessof300mAat5V.
Thisenablesstandardpin-outamplifierstobeusedashighcurrentbuffersorincoildriverapplications.
TheTLV4112offerstheexceptionalthermalimpedancerequiredforamplifiersdeliveringhighcurrentlevels.
ORDERINGINFORMATION(1)PACKAGEPRODUCTPACKAGEORDERABLEPARTNUMBERPACKAGEQUANTITYDESIGNATORTLV4112TDA1400TLV4112TDBaredieinwafflepack(2)TLV4112TDA210(1)Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTIwebsiteatwww.
ti.
com.
(2)ProcessingispertheTexasInstrumentscommercialproductionbaselineandisincompliancewiththeTexasInstrumentsQualityControlSystemineffectatthetimeofmanufacture.
ElectricalscreeningconsistsofDCparametricandfunctionaltestingatroomtemperatureonly.
UnlessotherwisespecifiedbyTexasInstrumentsACperformanceandperformanceovertemperatureisnotwarranted.
VisualInspectionisperformedinaccordancewithMIL-STD-883TestMethod2010ConditionBat75Xminimum.
1Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
PRODUCTIONDATAinformationiscurrentasofpublicationdate.
Copyright2012,TexasInstrumentsIncorporatedProductsconformtospecificationsperthetermsoftheTexasInstrumentsstandardwarranty.
Productionprocessingdoesnotnecessarilyincludetestingofallparameters.
TLV4112-DIESGLS411–NOVEMBER2012www.
ti.
comThisintegratedcircuitcanbedamagedbyESD.
TexasInstrumentsrecommendsthatallintegratedcircuitsbehandledwithappropriateprecautions.
Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.
Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
BAREDIEINFORMATIONBACKSIDEBONDPADBONDPADDIETHICKNESSBACKSIDEFINISHPOTENTIALMETALLIZATIONCOMPOSITIONTHICKNESS10.
5mils.
SiliconwithbackgrindFloatingAlCuTiw1540nm2SubmitDocumentationFeedbackCopyright2012,TexasInstrumentsIncorporatedTLV4112-DIEwww.
ti.
comSGLS411–NOVEMBER2012Table1.
BondPadCoordinatesinMicronsDESCRIPTIONPADNUMBERXMINYMINXMAXYMAX1OUT1234.
75121.
75334.
75221.
751IN-2676.
5121.
75776.
5221.
751IN+3892.
25121.
75992.
25221.
75GND41175.
25141.
251275.
25241.
25N/C51197.
25279.
251274.
25356.
252IN+61175.
251048.
251275.
251148.
252IN-7891.
751048.
25991.
751148.
252OUT8539.
51048.
25639.
51148.
25N/C9318.
251063395.
251140VDD10121.
751048.
25221.
751148.
25N/C11121.
75933.
25198.
751010.
25Copyright2012,TexasInstrumentsIncorporatedSubmitDocumentationFeedback3PACKAGEOPTIONADDENDUMwww.
ti.
com10-Oct-2013Addendum-Page1PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)OpTemp(°C)DeviceMarking(4/5)SamplesTLV4112TDA1ACTIVE0400TBDCallTIN/AforPkgType0to0TLV4112TDA2ACTIVE010TBDCallTIN/AforPkgType0to0(1)Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.
Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.
Samplesmayormaynotbeavailable.
OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.
ti.
com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.
TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.
1%byweightinhomogeneousmaterials.
Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.
ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.
1%byweightinhomogeneousmaterial)(3)MSL,PeakTemp.
--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
(4)Theremaybeadditionalmarking,whichrelatestothelogo,thelottracecodeinformation,ortheenvironmentalcategoryonthedevice.
(5)MultipleDeviceMarkingswillbeinsideparentheses.
OnlyoneDeviceMarkingcontainedinparenthesesandseparatedbya"~"willappearonadevice.
IfalineisindentedthenitisacontinuationofthepreviouslineandthetwocombinedrepresenttheentireDeviceMarkingforthatdevice.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.
TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.
Effortsareunderwaytobetterintegrateinformationfromthirdparties.
TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.
TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
IMPORTANTNOTICETexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46,latestissue,andtodiscontinueanyproductorserviceperJESD48,latestissue.
Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.
Allsemiconductorproducts(alsoreferredtohereinas"components")aresoldsubjecttoTI'stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.
TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI'stermsandconditionsofsaleofsemiconductorproducts.
TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.
Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarilyperformed.
TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers'products.
BuyersareresponsiblefortheirproductsandapplicationsusingTIcomponents.
TominimizetherisksassociatedwithBuyers'productsandapplications,Buyersshouldprovideadequatedesignandoperatingsafeguards.
TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orotherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.
InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyorendorsementthereof.
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Informationofthirdpartiesmaybesubjecttoadditionalrestrictions.
ResaleofTIcomponentsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatcomponentorservicevoidsallexpressandanyimpliedwarrantiesfortheassociatedTIcomponentorserviceandisanunfairanddeceptivebusinesspractice.
TIisnotresponsibleorliableforanysuchstatements.
Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirementsconcerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybeprovidedbyTI.
Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhichanticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcauseharmandtakeappropriateremedialactions.
BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofanyTIcomponentsinsafety-criticalapplications.
Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.
Withsuchcomponents,TI'sgoalistohelpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsandrequirements.
Nonetheless,suchcomponentsaresubjecttotheseterms.
NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersofthepartieshaveexecutedaspecialagreementspecificallygoverningsuchuse.
OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor"enhancedplastic"aredesignedandintendedforuseinmilitary/aerospaceapplicationsorenvironments.
BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponentswhichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.
TIhasspecificallydesignatedcertaincomponentsasmeetingISO/TS16949requirements,mainlyforautomotiveuse.
Inanycaseofuseofnon-designatedproducts,TIwillnotberesponsibleforanyfailuretomeetISO/TS16949.
ProductsApplicationsAudiowww.
ti.
com/audioAutomotiveandTransportationwww.
ti.
com/automotiveAmplifiersamplifier.
ti.
comCommunicationsandTelecomwww.
ti.
com/communicationsDataConvertersdataconverter.
ti.
comComputersandPeripheralswww.
ti.
com/computersDLPProductswww.
dlp.
comConsumerElectronicswww.
ti.
com/consumer-appsDSPdsp.
ti.
comEnergyandLightingwww.
ti.
com/energyClocksandTimerswww.
ti.
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ti.
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ti.
comMedicalwww.
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ti.
comSecuritywww.
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ti.
comSpace,AvionicsandDefensewww.
ti.
com/space-avionics-defenseMicrocontrollersmicrocontroller.
ti.
comVideoandImagingwww.
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com/videoRFIDwww.
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comOMAPApplicationsProcessorswww.
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ti.
com/wirelessconnectivityMailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265Copyright2013,TexasInstrumentsIncorporated