互联机械设计论文 导电胶互联工艺仿真分析

GUILIN UNIVERSITY OF TECHNOLOGY

题目 导电胶互联工艺仿真分析

学 院机械与控制工程学院专业(方向) 机械设计制造及其自动化

机械装备设计与制造

摘 要

随着微电子制造业的飞速发展 电子元器件是往微型化、小型化、高度集成化和高密度化的方向发展。导电胶作为一种新型的无铅焊接材料互联的温度比较低互联工艺简单方便操作可以实现高的线分辨率实现细间距的接合提高实际生产的质量和效率节约生产成本。

然而诸多因素影响着导电胶的互联性能 由于元器件、胶体及电路基板的热膨胀系数不匹配而导致胶体内部产生热应力甚至导致胶体的热失效所以残余应力分析是胶体机械可靠性预测的基础。

本文首先介绍了导电胶的组成、分类、作用和互联工艺过程等。其次用ANSYS软件建立芯片与基板导电胶互联的模型对导电胶残余应力进行仿真分析分析影响导电胶互联性能的主要工艺因素即温度、压力、时间对残余应力的影响最后分析多因素耦合作用对导电胶互联残余应力的影响并设计了五因素二水平的正交试验表总共有三十二个组合并对各因素因子组合进行了仿真分析得到了同一因素不同水平对导电胶残余应力的影响以及不同因素对导电胶互联残余应力影响的大小程度和影响顺序。所得结果对芯片与基板组装减小导电胶互联后残余应力提供理论依据为各工艺参数及尺寸参数的选择具有一定指导意义。

关键词导电胶互联工艺残余应力仿真分析

I

Conductive adhesive process simulation analysis of the InternetAbstractWith the rapid development of microelectronics manufacturing, electroniccomponents is toward miniaturization, the direction of miniaturization,high integration andhigh density. Conductive adhesive as a new type of lead-free welding material,interconnection of the temperature is lower, interconnection process is simple, convenientoperation, can achieve high resolution of line, can realize the fine pitch joint, so as toimprove the quality and efficiency of the process of production, saving the cost ofproduction.

However,many factors affect the conductive adhesive performance of the Internet,because components, colloid and substrate caused by thermal expansion coefficientmismatch thermal stress is generated in colloid led to the thermal failure of colloid, so theresidual stress analysis is the foundation of the solder joint mechanical reliabilityprediction.

This paper first introduces the composition, classification and function of theconductive adhesive, and Internet technology, etc. Second chip is established by usingANSYS software and the substrate conductive adhesive interconnection model, simulationanalysis was made on the residual stress, analysis the main technological factorsinfluencing the performances of conductive adhesive interconnection namely, temperature,pressure and time on the influence of residual stress;The analysis of multi-factor couplinginfluence on residual stress of conductive adhesive interconnected, and design the fivefactors of two levels orthogonal test table, a total of 32 combinations, and factorcombination of various factors on the simulation analysis, get the same factors theinfluence of different level of conductive adhesive residual stress, residual stress and thedifferent factors on the conductive adhesive interconnection influence degree and influencethe size of the order.The results of the chip and the substrate assembly decrease conductiveadhesive provide theoretical basis for residual stress after connected, for the selection ofvarious process parameters and the size parameters have certain guiding significance.Key wo rds Conductive adhesive; Internet technology; residual stress; simulation

II