nsddr2内存价格
ddr2内存价格 时间:2021-01-20 阅读:()
ProductsandspecificationsdiscussedhereinaresubjecttochangebyMicronwithoutnotice.
512Mb:x4,x8,x16DDR2SDRAMFeaturesMicronConfidentialandProprietaryPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN12005MicronTechnology,Inc.
Allrightsreserved.
DDR2SDRAMMT47H128M4–32Megx4x4banksMT47H64M8–16Megx8x4banksMT47H32M16–8Megx16x4banksForfunctionalandparametricspecifications,refertotheproductdatasheetonMicron'sWebsite:www.
micron.
comFeaturesFBGAballsuseleadedsolderOptionsMarkingConfiguration–128Megx4(32Megx4x4banks)128M4–64Megx8(16Megx8x4banks)64M8–32Megx16(8Megx16x4banks)32M16FBGApackage(leadedsolder)–84-ballFBGA(12mmx12.
5mm,:B)(10mmx12.
5mm,:D)GCFN–60-ballFBGA(12mmx10mm,:B)(10mmx10mm,:D)GBF6Timing–cycletime–5.
0ns@CL=3(DDR2-400)-5E–3.
75ns@CL=4(DDR2-533)-37E–3.
0ns@CL=5(DDR2-667)-3–3.
0ns@CL=4(DDR2-667)-3E–2.
5ns@CL=6(DDR2-800)-25–2.
5ns@CL=5(DDR2-800)-25EOptions(Continued)MarkingSelfrefresh–StandardNone–Low-PowerLOperatingtemperature–Commercial(0°C≤TC≤85°C)None–Industrial(–40°C≤TC≤95°C;–40°C≤TA≤85°C)ITRevision:A/:B/:DPartNumbersFigure1:512MbDDR2(LeadedSolder)PartNumbersNotes:1.
Notallspeedsandconfigurationsareavailable.
ContactMicronforcurrentrevision.
Package84-Ball12x12.
5FBGA84-Ball10x12.
5FBGA60-Ball12x10FBGA60-Ball10x10FBGAGCFNGBF6ExamplePartNumber:MT47H64M8BT-37EConfiguration128Megx464Megx832Megx16128M464M832M16SpeedGradetCK=5ns,CL=3tCK=3.
75ns,CL=4tCK=3ns,CL=5tCK=3ns,CL=4tCK=2.
5ns,CL=5-5E-37E-3-3E-25E-ConfigurationMT47HPackageSpeedRevisionRevision:A/:B/:D:Low-PowerIndustrialTemperatureLIT{PDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN22005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMFBGAPartMarkingDecoderMicronConfidentialandProprietaryFBGAPartMarkingDecoderDuetospacelimitations,FBGA-packagedcomponentshaveanabbreviatedpartmarkingthatisdifferentfromthepartnumber.
Micron'sFBGAPartMarkingDecoderisavailableatwww.
micron.
com/decoder.
PackageDimensionsFigure2:84-BallFBGAPackage–12mmx12.
5mm(x16,:B)Note:Alldimensionsareinmillimeters.
0.
80±0.
050.
10CCMOLDCOMPOUND:EPOXYNOVALACSOLDERBALLMATERIAL:96.
5%Sn,3%Ag,0.
5%CuSOLDERBALLPAD:0.
33NONSOLDERMASKDEFINEDSUBSTRATEMATERIAL:PLASTICLAMINATE5.
6011.
20BALLA1IDBALLA1BALLA1ID0.
80TYP6.
00±0.
053.
2012.
00±0.
106.
40BALLA9SEATINGPLANE12.
50±0.
106.
25±0.
050.
80TYP84X0.
45CLCLSOLDERBALLDIAMETERREFERSTOPOST-REFLOWCONDITION.
1.
20MAX0.
155±0.
0131.
80±0.
05CTRPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN32005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsMicronConfidentialandProprietaryFigure3:84-BallFBGAPackage–10mmx12.
5mm(x16,:D)Note:Alldimensionsareinmillimeters.
BALLA1ID1.
20MAXBALLA9BALLA1ID0.
80TYP0.
80TYP3.
206.
40BALLA110.
00±0.
105.
00±0.
05SOLDERBALLDIAMETERREFERSTOPOSTREFLOWCONDITION.
THEPRE-REFLOWDIAMETERIS0.
4284X0.
45SOLDERBALLMATERIAL:62%Sn,36%Pb,2%AgOR96.
5%Sn,3%Ag,0.
5%CuNONSOLDERMASKDEFINEDBALLPAD:0.
33MOLDCOMPOUND:EPOXYNOVOLACSUBSTRATEMATERIAL:PLASTICLAMINATE11.
205.
606.
25±0.
0512.
50±0.
10CLCL0.
80±0.
050.
155±0.
013SEATINGPLANEC1.
80±0.
05CTR0.
10CPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN42005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsMicronConfidentialandProprietaryFigure4:60-BallFBGAPackage–12mmx10mm(x4,x8;:B)Note:Alldimensionsareinmillimeters.
0.
80±0.
050.
10CC0.
155±0.
013MOLDCOMPOUND:EPOXYNOVALACSOLDERBALLMATERIAL:96.
5%Sn,3%Ag,0.
5%CuSOLDERBALLPAD:0.
33NONSOLDERMASKDEFINEDSUBSTRATEMATERIAL:PLASTICLAMINATE4.
008.
00BALLA1IDBALLA1BALLA1ID0.
80TYP6.
00±0.
053.
2012.
00±0.
106.
40BALLA9SEATINGPLANE10.
00±0.
105.
00±0.
050.
80TYP60X0.
45CLCL1.
20MAX1.
80±0.
05CTRSOLDERBALLDIAMETERREFERSTOPOST-REFLOWCONDITION.
8000S.
FederalWay,P.
O.
Box6,Boise,ID83707-0006,Tel:208-368-3900prodmktg@micron.
comwww.
micron.
comCustomerCommentLine:800-932-4992Micron,theMlogo,andtheMicronlogoaretrademarksofMicronTechnology,Inc.
Allothertrademarksarethepropertyoftheirrespectiveowners.
Thisdatasheetcontainsminimumandmaximumlimitsspecifiedoverthecompletepowersupplyandtemperaturerangeforproductiondevices.
Althoughconsideredfinal,thesespecificationsaresubjecttochange,asfurtherproductdevelopmentanddatacharacterizationsometimesoccur.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN52005MicronTechnology,Inc.
Allrightsreserved.
MicronConfidentialandProprietaryFigure5:60-BallFBGAPackage–10mmx10mm(x4,x8;:D)Note:Alldimensionsareinmillimeters.
BALLA1ID1.
20MAXMOLDCOMPOUND:EPOXYNOVOLACSUBSTRATEMATERIAL:PLASTICLAMINATESOLDERBALLMATERIAL:62%Sn,36%Pb,2%AgOR96.
5%Sn,3%Ag,0.
5%CuNONSOLDERMASKDEFINEDBALLPAD:0.
33BALLA90.
80TYP10.
00±0.
105.
00±0.
053.
204.
000.
80±0.
050.
155±0.
013SEATINGPLANEC8.
006.
401.
80±0.
05CTR0.
10C60X0.
45SOLDERBALLDIAMETERREFERSTOPOSTREFLOWCONDITION.
THEPRE-REFLOWDIAMETERIS0.
42CL10.
00±0.
10BALLA1BALLA1ID0.
80TYP5.
00±0.
05CL
512Mb:x4,x8,x16DDR2SDRAMFeaturesMicronConfidentialandProprietaryPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN12005MicronTechnology,Inc.
Allrightsreserved.
DDR2SDRAMMT47H128M4–32Megx4x4banksMT47H64M8–16Megx8x4banksMT47H32M16–8Megx16x4banksForfunctionalandparametricspecifications,refertotheproductdatasheetonMicron'sWebsite:www.
micron.
comFeaturesFBGAballsuseleadedsolderOptionsMarkingConfiguration–128Megx4(32Megx4x4banks)128M4–64Megx8(16Megx8x4banks)64M8–32Megx16(8Megx16x4banks)32M16FBGApackage(leadedsolder)–84-ballFBGA(12mmx12.
5mm,:B)(10mmx12.
5mm,:D)GCFN–60-ballFBGA(12mmx10mm,:B)(10mmx10mm,:D)GBF6Timing–cycletime–5.
0ns@CL=3(DDR2-400)-5E–3.
75ns@CL=4(DDR2-533)-37E–3.
0ns@CL=5(DDR2-667)-3–3.
0ns@CL=4(DDR2-667)-3E–2.
5ns@CL=6(DDR2-800)-25–2.
5ns@CL=5(DDR2-800)-25EOptions(Continued)MarkingSelfrefresh–StandardNone–Low-PowerLOperatingtemperature–Commercial(0°C≤TC≤85°C)None–Industrial(–40°C≤TC≤95°C;–40°C≤TA≤85°C)ITRevision:A/:B/:DPartNumbersFigure1:512MbDDR2(LeadedSolder)PartNumbersNotes:1.
Notallspeedsandconfigurationsareavailable.
ContactMicronforcurrentrevision.
Package84-Ball12x12.
5FBGA84-Ball10x12.
5FBGA60-Ball12x10FBGA60-Ball10x10FBGAGCFNGBF6ExamplePartNumber:MT47H64M8BT-37EConfiguration128Megx464Megx832Megx16128M464M832M16SpeedGradetCK=5ns,CL=3tCK=3.
75ns,CL=4tCK=3ns,CL=5tCK=3ns,CL=4tCK=2.
5ns,CL=5-5E-37E-3-3E-25E-ConfigurationMT47HPackageSpeedRevisionRevision:A/:B/:D:Low-PowerIndustrialTemperatureLIT{PDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN22005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMFBGAPartMarkingDecoderMicronConfidentialandProprietaryFBGAPartMarkingDecoderDuetospacelimitations,FBGA-packagedcomponentshaveanabbreviatedpartmarkingthatisdifferentfromthepartnumber.
Micron'sFBGAPartMarkingDecoderisavailableatwww.
micron.
com/decoder.
PackageDimensionsFigure2:84-BallFBGAPackage–12mmx12.
5mm(x16,:B)Note:Alldimensionsareinmillimeters.
0.
80±0.
050.
10CCMOLDCOMPOUND:EPOXYNOVALACSOLDERBALLMATERIAL:96.
5%Sn,3%Ag,0.
5%CuSOLDERBALLPAD:0.
33NONSOLDERMASKDEFINEDSUBSTRATEMATERIAL:PLASTICLAMINATE5.
6011.
20BALLA1IDBALLA1BALLA1ID0.
80TYP6.
00±0.
053.
2012.
00±0.
106.
40BALLA9SEATINGPLANE12.
50±0.
106.
25±0.
050.
80TYP84X0.
45CLCLSOLDERBALLDIAMETERREFERSTOPOST-REFLOWCONDITION.
1.
20MAX0.
155±0.
0131.
80±0.
05CTRPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN32005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsMicronConfidentialandProprietaryFigure3:84-BallFBGAPackage–10mmx12.
5mm(x16,:D)Note:Alldimensionsareinmillimeters.
BALLA1ID1.
20MAXBALLA9BALLA1ID0.
80TYP0.
80TYP3.
206.
40BALLA110.
00±0.
105.
00±0.
05SOLDERBALLDIAMETERREFERSTOPOSTREFLOWCONDITION.
THEPRE-REFLOWDIAMETERIS0.
4284X0.
45SOLDERBALLMATERIAL:62%Sn,36%Pb,2%AgOR96.
5%Sn,3%Ag,0.
5%CuNONSOLDERMASKDEFINEDBALLPAD:0.
33MOLDCOMPOUND:EPOXYNOVOLACSUBSTRATEMATERIAL:PLASTICLAMINATE11.
205.
606.
25±0.
0512.
50±0.
10CLCL0.
80±0.
050.
155±0.
013SEATINGPLANEC1.
80±0.
05CTR0.
10CPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN42005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsMicronConfidentialandProprietaryFigure4:60-BallFBGAPackage–12mmx10mm(x4,x8;:B)Note:Alldimensionsareinmillimeters.
0.
80±0.
050.
10CC0.
155±0.
013MOLDCOMPOUND:EPOXYNOVALACSOLDERBALLMATERIAL:96.
5%Sn,3%Ag,0.
5%CuSOLDERBALLPAD:0.
33NONSOLDERMASKDEFINEDSUBSTRATEMATERIAL:PLASTICLAMINATE4.
008.
00BALLA1IDBALLA1BALLA1ID0.
80TYP6.
00±0.
053.
2012.
00±0.
106.
40BALLA9SEATINGPLANE10.
00±0.
105.
00±0.
050.
80TYP60X0.
45CLCL1.
20MAX1.
80±0.
05CTRSOLDERBALLDIAMETERREFERSTOPOST-REFLOWCONDITION.
8000S.
FederalWay,P.
O.
Box6,Boise,ID83707-0006,Tel:208-368-3900prodmktg@micron.
comwww.
micron.
comCustomerCommentLine:800-932-4992Micron,theMlogo,andtheMicronlogoaretrademarksofMicronTechnology,Inc.
Allothertrademarksarethepropertyoftheirrespectiveowners.
Thisdatasheetcontainsminimumandmaximumlimitsspecifiedoverthecompletepowersupplyandtemperaturerangeforproductiondevices.
Althoughconsideredfinal,thesespecificationsaresubjecttochange,asfurtherproductdevelopmentanddatacharacterizationsometimesoccur.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN52005MicronTechnology,Inc.
Allrightsreserved.
MicronConfidentialandProprietaryFigure5:60-BallFBGAPackage–10mmx10mm(x4,x8;:D)Note:Alldimensionsareinmillimeters.
BALLA1ID1.
20MAXMOLDCOMPOUND:EPOXYNOVOLACSUBSTRATEMATERIAL:PLASTICLAMINATESOLDERBALLMATERIAL:62%Sn,36%Pb,2%AgOR96.
5%Sn,3%Ag,0.
5%CuNONSOLDERMASKDEFINEDBALLPAD:0.
33BALLA90.
80TYP10.
00±0.
105.
00±0.
053.
204.
000.
80±0.
050.
155±0.
013SEATINGPLANEC8.
006.
401.
80±0.
05CTR0.
10C60X0.
45SOLDERBALLDIAMETERREFERSTOPOSTREFLOWCONDITION.
THEPRE-REFLOWDIAMETERIS0.
42CL10.
00±0.
10BALLA1BALLA1ID0.
80TYP5.
00±0.
05CL
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CloudCone：$14/年KVM-512MB/10GB/3TB/洛杉矶机房
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