A1777qmys
777QMYS 时间:2021-03-03 阅读:()
TFBGA100SOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mm8February2016Packageinformation1.
PackagesummaryTerminalpositioncodeB(bottom)PackagetypedescriptivecodeTFBGA100PackagetypeindustrycodeTFBGA100PackagestyledescriptivecodeTFBGA(thinfine-pitchballgridarray)PackagestylesuffixcodeNA(notapplicable)PackagebodymaterialtypeP(plastic)JEDECpackageoutlinecodeMO-195MountingmethodtypeS(surfacemount)Issuedate20-6-2002Table1.
PackagesummarySymbolParameterMinTypNomMaxUnitDpackagelength5.
9-66.
1mmEpackagewidth5.
9-66.
1mmAseatedheight[tbd]-1.
11.
1mmA2packageheight0.
75-0.
80.
85mmn2actualquantityoftermination--100-NXPSemiconductorsSOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmSOT777-1Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2016.
AllrightsreservedPackageinformation8February20162/52.
PackageoutlineballA1indexarea0.
5A1bA2UNITDyeREFERENCESOUTLINEVERSIONEUROPEANPROJECTIONISSUEDATE02-06-20IECJEDECJEITAmm1.
10.
250.
150.
850.
756.
15.
9y16.
15.
90.
350.
250.
08DIMENSIONS(mmaretheoriginaldimensions)SOT777-1MO-195E0.
150.
1e14.
5e24.
5v0.
05w02.
55mmscaleSOT777-1TFBGA100:plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmAmax.
AA2A1detailXXDEABCDEFHJKG24689101357BAballA1indexareayy1Ceee1bCe21/2e1/2eACCB#vM#wMFig.
1.
PackageoutlineTFBGA100(SOT777-1)NXPSemiconductorsSOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmSOT777-1Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2016.
AllrightsreservedPackageinformation8February20163/53.
SolderingDIMENSIONSinmmPSLSPSRHxHyHxHySOT777-1solderlandplussolderpasteoccupiedareaFootprintinformationforreflowsolderingofTFBGA100packagesolderlandsolderpastedepositsolderresistPPSLSPSRGenericfootprintpatternRefertothepackageoutlinedrawingforactuallayoutdetailXseedetailXsot777-1_fr0.
500.
2750.
3000.
4256.
5006.
500Fig.
2.
ReflowsolderingfootprintforTFBGA100(SOT777-1)NXPSemiconductorsSOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmSOT777-1Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2016.
AllrightsreservedPackageinformation8February20164/54.
LegalinformationDisclaimersLimitedwarrantyandliability—Informationinthisdocumentisbelievedtobeaccurateandreliable.
However,NXPSemiconductorsdoesnotgiveanyrepresentationsorwarranties,expressedorimplied,astotheaccuracyorcompletenessofsuchinformationandshallhavenoliabilityfortheconsequencesofuseofsuchinformation.
NXPSemiconductorstakesnoresponsibilityforthecontentinthisdocumentifprovidedbyaninformationsourceoutsideofNXPSemiconductors.
InnoeventshallNXPSemiconductorsbeliableforanyindirect,incidental,punitive,specialorconsequentialdamages(including-withoutlimitation-lostprofits,lostsavings,businessinterruption,costsrelatedtotheremovalorreplacementofanyproductsorreworkcharges)whetherornotsuchdamagesarebasedontort(includingnegligence),warranty,breachofcontractoranyotherlegaltheory.
Notwithstandinganydamagesthatcustomermightincurforanyreasonwhatsoever,NXPSemiconductors'aggregateandcumulativeliabilitytowardscustomerfortheproductsdescribedhereinshallbelimitedinaccordancewiththeTermsandconditionsofcommercialsaleofNXPSemiconductors.
Righttomakechanges—NXPSemiconductorsreservestherighttomakechangestoinformationpublishedinthisdocument,includingwithoutlimitationspecificationsandproductdescriptions,atanytimeandwithoutnotice.
Thisdocumentsupersedesandreplacesallinformationsuppliedpriortothepublicationhereof.
NXPSemiconductorsSOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmSOT777-1Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2016.
AllrightsreservedPackageinformation8February20165/55.
Contents1.
Packagesummary.
12.
Packageoutline.
23.
Soldering.
34.
Legalinformation.
4NXPSemiconductorsN.
V.
2016.
AllrightsreservedFormoreinformation,pleasevisit:http://www.
nxp.
comForsalesofficeaddresses,pleasesendanemailto:salesaddresses@nxp.
comDateofrelease:8February2016
8mm8February2016Packageinformation1.
PackagesummaryTerminalpositioncodeB(bottom)PackagetypedescriptivecodeTFBGA100PackagetypeindustrycodeTFBGA100PackagestyledescriptivecodeTFBGA(thinfine-pitchballgridarray)PackagestylesuffixcodeNA(notapplicable)PackagebodymaterialtypeP(plastic)JEDECpackageoutlinecodeMO-195MountingmethodtypeS(surfacemount)Issuedate20-6-2002Table1.
PackagesummarySymbolParameterMinTypNomMaxUnitDpackagelength5.
9-66.
1mmEpackagewidth5.
9-66.
1mmAseatedheight[tbd]-1.
11.
1mmA2packageheight0.
75-0.
80.
85mmn2actualquantityoftermination--100-NXPSemiconductorsSOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmSOT777-1Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2016.
AllrightsreservedPackageinformation8February20162/52.
PackageoutlineballA1indexarea0.
5A1bA2UNITDyeREFERENCESOUTLINEVERSIONEUROPEANPROJECTIONISSUEDATE02-06-20IECJEDECJEITAmm1.
10.
250.
150.
850.
756.
15.
9y16.
15.
90.
350.
250.
08DIMENSIONS(mmaretheoriginaldimensions)SOT777-1MO-195E0.
150.
1e14.
5e24.
5v0.
05w02.
55mmscaleSOT777-1TFBGA100:plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmAmax.
AA2A1detailXXDEABCDEFHJKG24689101357BAballA1indexareayy1Ceee1bCe21/2e1/2eACCB#vM#wMFig.
1.
PackageoutlineTFBGA100(SOT777-1)NXPSemiconductorsSOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmSOT777-1Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2016.
AllrightsreservedPackageinformation8February20163/53.
SolderingDIMENSIONSinmmPSLSPSRHxHyHxHySOT777-1solderlandplussolderpasteoccupiedareaFootprintinformationforreflowsolderingofTFBGA100packagesolderlandsolderpastedepositsolderresistPPSLSPSRGenericfootprintpatternRefertothepackageoutlinedrawingforactuallayoutdetailXseedetailXsot777-1_fr0.
500.
2750.
3000.
4256.
5006.
500Fig.
2.
ReflowsolderingfootprintforTFBGA100(SOT777-1)NXPSemiconductorsSOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmSOT777-1Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2016.
AllrightsreservedPackageinformation8February20164/54.
LegalinformationDisclaimersLimitedwarrantyandliability—Informationinthisdocumentisbelievedtobeaccurateandreliable.
However,NXPSemiconductorsdoesnotgiveanyrepresentationsorwarranties,expressedorimplied,astotheaccuracyorcompletenessofsuchinformationandshallhavenoliabilityfortheconsequencesofuseofsuchinformation.
NXPSemiconductorstakesnoresponsibilityforthecontentinthisdocumentifprovidedbyaninformationsourceoutsideofNXPSemiconductors.
InnoeventshallNXPSemiconductorsbeliableforanyindirect,incidental,punitive,specialorconsequentialdamages(including-withoutlimitation-lostprofits,lostsavings,businessinterruption,costsrelatedtotheremovalorreplacementofanyproductsorreworkcharges)whetherornotsuchdamagesarebasedontort(includingnegligence),warranty,breachofcontractoranyotherlegaltheory.
Notwithstandinganydamagesthatcustomermightincurforanyreasonwhatsoever,NXPSemiconductors'aggregateandcumulativeliabilitytowardscustomerfortheproductsdescribedhereinshallbelimitedinaccordancewiththeTermsandconditionsofcommercialsaleofNXPSemiconductors.
Righttomakechanges—NXPSemiconductorsreservestherighttomakechangestoinformationpublishedinthisdocument,includingwithoutlimitationspecificationsandproductdescriptions,atanytimeandwithoutnotice.
Thisdocumentsupersedesandreplacesallinformationsuppliedpriortothepublicationhereof.
NXPSemiconductorsSOT777-1plasticthinfine-pitchballgridarraypackage;100balls;body6x6x0.
8mmSOT777-1Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2016.
AllrightsreservedPackageinformation8February20165/55.
Contents1.
Packagesummary.
12.
Packageoutline.
23.
Soldering.
34.
Legalinformation.
4NXPSemiconductorsN.
V.
2016.
AllrightsreservedFormoreinformation,pleasevisit:http://www.
nxp.
comForsalesofficeaddresses,pleasesendanemailto:salesaddresses@nxp.
comDateofrelease:8February2016
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