nxp19ise.com

117.
08.
2020Ver(A)IntroductionseddLED(SmartEmbeddedDigitalDriverLED)istheworld'sfirstdigitalLEDwhichcombinesRGBLED,LEDDriverandadvancedISELEDcommunicationprotocolintegratedintoasinglepackage.
Itisarevolutionaryapproachforautomotiveambientlightingwithfully-calibratedRGBLEDtotargetcoordinates.
seddLED3.
0A3A-FKG-1400-1ispre-calibratedtoD65whitepointwithanaccuracywithin3SDCMstepsat1,400mcd.
ThisdocumentprovidesguidelinesonhowtodrivetheseddLED3.
0withthefocusontheLEDpackagedesign,PCBdesign,microcontrollerandISELEDmoduletomoduleconnectionsetup.
Allfunctionscanbecontrolledviathemicrocontrollerunit(MCU)thatprovidestheISELEDserialcommunicationprotocol.
ListofAbbreviationsandAcronymsAPIApplicationProgrammingInterfaceCANControllerAreaNetworkEMIElectromagneticInterferenceESDElectrostaticDischargeGNDGroundLINLocalInterconnectNetworkMCUMicrocontrollerUnitPCBPrintedCircuitBoardAPPLICATIONNOTES:seddLED3.
0(A3A-FKG)217.
08.
2020Ver(A)seddLED3.
0ApplicationNotesContents1.
UserApplicationDevelopmentSetup1.
1seddLED3.
0A3A-FKG-1400-13-41.
2NXPSemiconductors51.
3MicrochipTechnologyInc51.
4BasicExternalComponentguide61.
5PCBdesignguide,pin-per-pinexplanation71.
6Extendedconnectionguide(module-to-module)explanation81.
7Extendedconnectionguide(module-to-module)viatwistedpairharness92.
TemperatureCompensationforRedLED2.
1LinearCompensation102.
2Non-LinearCompensation112.
3Non-lineartemperaturecompensationlook-uptable12-143.
SurfaceMountingGuideline3.
1seddLED3.
0A3A-FKGPackageDimension153.
2ReflowSolderingProfile163.
3SurfaceMounting–FactorstoConsider17-214.
RevisionHistory22317.
08.
2020Ver(A)seddLED3.
0ApplicationNotes1.
UserApplicationDevelopmentSetupThissectionprovidesguidelinestothedevelopmentofseddLED3.
0LEDtypicalapplicationsetup.
SelectionofrightexternalcomponentandPCBlayoutiscriticaltoensureproperfunctionalityandheatdissipationwhendaisy-chainmanyseddLED3.
0LEDtogetherontoasmallPCBsurface.
1.
1seddLED3.
0A3A-FKG-1400-1FunctionandFeatures:Smallpackageoutline(LxWxH)of3.
2x3.
3x1.
35mm.
Lowthermalresistance.
Superiorcorrosionresistant.
QualifiedaccordingtoJEDECmoisturesensitivityLevel2.
CompatibletoIRreflowsoldering.
SerialcommunicationwithISELEDcompliance.
Bidirectional,half-duplex,2MBit/s,serialcommunication.
8-bitbrightnessresolutionforred,green,andblueLED.
Build-intemperaturesensor.
Temperaturecompensationonredforconstantbrightness.
Build-indiagnosticfunctions.
Environmentallyfriendly,RoHScomplianceCompliancetoautomotivestandard;AEC-Q102&AEC-Q100.
417.
08.
2020Ver(A)seddLED3.
0ApplicationNotesA3A-FKGPinoutPleasefollowthispin-outforconnectionandpinfunctionality:TopView517.
08.
2020Ver(A)seddLED3.
0ApplicationNotes1.
2.
NXPSemiconductorsNXPSemiconductorsofferfullMCUseriesofS32KxxcustompartnumberwithISELEDdriverlibrary.
However,userstillcanusethenon-ISELEDS32Kxxpartnumberwhichcomewithevaluationlicenseandthesendingcommandsarelimitedtomaximumof150,000.
PleaseconsultyournearestNXPSalesrepresentativetoenquireS32KxxISELEDPartOffering.
UseralsocangetmoreinformationregardingtheevaluationlicenseandNXPISELEDcustompartnumber,pleaseclickbelowlink:https://www.
nxp.
com/S32K-iseledForstepbystepGetStartedguide,pleaseclickbelowlink:https://www.
nxp.
com/document/guide/get-started-with-the-s32k-iseled:GS-S32K-ISELEDForadvancedtechnicalinformation,usercangetsupportfromtheNXPS32Kcommunitysite:https://community.
nxp.
com/community/s32/s32k1.
3.
MicrochipTechnologyIncMicrochipTechnologyIncofferavarietyofscalable8-,16-and32-bitMCUsand16-bitdsPICDigitalSignalControllers(DSCs)tohelpuserdevelopISELEDprotocol-basedin-carlightingsystem.
PleaseconsultyournearestMicrochipSalesrepresentativetoenquireMCUpartoffering.
UseralsocangetmoreinformationregardingtheevaluationlicenseandMicrochipISELEDcustompartnumber,pleaseclickbelowlink:https://www.
microchip.
com/design-centers/automotive-solutions/automotive-applications/body-electronics/iseled617.
08.
2020Ver(A)seddLED3.
0ApplicationNotes1.
4.
BasicExternalComponentguideFigure1showsatypicalsetuplayoutforseddLED3.
0LED,connectingMCUtoaseriesofseddLED3.
0LEDs.
Inordertopreventvoltagedrops,itisrecommendedtomountthecapacitorsC1closelytoeachseddLED3.
05V_LED(pin8).
ThedimensioningofthecapacitorsdependsonthePCBlayoutandthesupplyconcept.
Incomingdata(SIO1_P)andclock(SIO1_N)canbeconnectedwithESDprotectiondiodeinparalleltoGND,forprotectionagainstvoltagespiketotheSIO1_PandSIO1_N.
FirstcommunicationconnectioninbetweenmicrocontrollertotheseddLED3.
0isbasedonsingle-endedformat.
Thus,foreachline,pleaseadd-on1Kpull-upresistorinparalleltothe5Vsupply.
Lastdevice'sSIO2_PandSIO2_NcanbeterminatedwithESDprotectiondeviceaswell.
Astheincomingsupplymustbekeptwithin4.
5V–5.
5V,it'srecommendedtoinstall5.
5Vzenertoprotectagainstover-voltage.
Figure1:TypicalApplicationLayout717.
08.
2020Ver(A)seddLED3.
0ApplicationNotes1.
5PCBdesignguide,pin-per-pinexplanation:Figure2belowshowsabriefwiringsetupfromMCUtothefirstandsecondseddLED3.
0LED.
seddLED3.
0LEDneedstobepoweredupwith5Vsupply.
TheremustbeacommongroundconnectingseddLED3.
0andMCUtogether.
Adedicatedgroundplaneisdesirableasitofferslowestpossibleinductanceforcurrenttoreturntoitssource.
Communicationprotocolfromfirstdevicetomicrocontroller(bothdataandclock)isconfiguredtobesingle-endedformat.
MostofthemicrocontrollerI/Opinsareconfiguredtobesingle-endedTX/RXformat.
Thus,itisvulnerabletonoiseandinterference.
It'sadvisabletokeeptheconnectionshortandbestiffirstseddLED3.
0LEDmountedonthesamePCBboardtotheMCUandcommunicationconnectionisroutedviaimpedancematchingPCBtrace.
KeepbothsignalconnectionneartoGNDforgroundshieldingadvantage.
Connectionfrom1stseddLED3.
0LEDto2ndseddLED3.
0LEDisconfiguredwithdifferentialformat.
Userdoesnotneedtoworryabouttheconversionfromsingle-endedformattodifferentialformat.
AllwillbetakencarebyseddLED3.
0LEDinternalmodule.
Figure2:WiringSetupGuidelinesMCUCapacitorCapacitor817.
08.
2020Ver(A)seddLED3.
0ApplicationNotes1.
6.
Extendedconnectionguide(module-to-module)explanation(referencetoNXPS32Kxxseries)Formultiplemodulesinvehicleinstallation,werecommendusertoinstallastand-alone,ISELEDcompatible,lowcostmicrocontrollertoeachindividualmodule.
EachmicrocontrollershouldrepresentownPCBmoduleslaveconnections.
ExampleofgoodsuggestionwillbeNXPS32K11x/14xArmCortexM4+andM0+microcontroller.
EachmicrocontrollercaninteractwitheachotherandconnectedtotheautomobileCAN/LINBus.
NXPalsooffersagoodrangeofCAN/LINtransceiver.
E.
gTJA1051proposedforbelowtypical4doorpanelseddLED3.
0stripconnectedtoNXPS32K1xxmicrocontroller,androutedtoCAN/LINBUSnetwork.
Figure3:seddLED3.
0DoorPanelStripwithS32K1xxMicrocontrollerConnectedtoIntegratedCAN/LINBus.
917.
08.
2020Ver(A)seddLED3.
0ApplicationNotes1.
7Extendedconnectionguide(module-to-module)viatwistedpairharnessISELEDcommunicationprotocolisdesignedtoenableeaseofinter-componentconnectionontheprintedcircuitboard.
WithinthesamePCB,firstseddLED3.
0LEDandmicrocontrollerhastoberoutedascloseaspossibleasitssingle-endedcommunicationformat.
Connectionfrom1stseddLED3.
0LEDto2ndseddLED3.
0LEDonwardswillbeconvertedtodifferentialformatinternally.
UnderunavoidablecircumstanceswherecustomerneedstoconnectfromPCBmoduletoPCBmodule,themaximumwireharnesslengthissubjecttorespectiveOEMEMI/EMCrequirements.
Fortheharnessconnectionsetup,it'sadvisabletousetwisted-pairwireacrossSIOx_PandSIOx_Ncommunicationpath.
Figure4:ModuletoModuleconnectionviatwistedpairharnessMCUDifferentialsignal,twistedpair.
notrecommendedforlongconnection.
CapacitorCapacitor1017.
08.
2020Ver(A)seddLED3.
0ApplicationNotes2.
TemperatureCompensationforRedLED2.
1LinearCompensationRedLEDsbrightnessisverysensitivetotemperature.
ISELEDICisembeddedwithautocompensationfeaturewithlineartemperaturecompensationtostabilizethebrightnessfluctuationacrossfulloperatingrange.
Figure5showsthedifferenceinRedLEDbrightnesswithouttemperaturecompensationandwithaseddLED3.
0lineartemperaturecompensation.
Figure5:RedLEDbrightness:withoutcompensation(left)andwithcompensation(right)RedLEDWithoutTemperatureCompensationRedLEDWithLinearTemperatureCompensation1117.
08.
2020Ver(A)seddLED3.
0ApplicationNotes2.
2Non-LinearCompensationA3A-FKG-1400-1isspecialcalibratedtoD65whitecolorat1400mcd.
TofurtherimprovetheD65whitecolormixedhomogeneityacrossfulloperatingtemperature,werecommendtousenon-linearcompensation.
Figure6showstheRedLEDbrightnessinnon-lineartemperaturecompensation.
Figure7showtheinD65whitecolormixedimprovementofnon-lineartemperaturecomparetolineartemperaturecompensation.
WecanobservesignificantD65whitecolormixedimprovementatextremecoldandhottemperature.
Figure6:RedLEDbrightnessinnon-lineartemperaturecompensation1217.
08.
2020Ver(A)seddLED3.
0ApplicationNotesFigure7:D65Color:Linearcompensation(left)andnon-linearcompensation(right)2.
3Non-lineartemperaturecompensationlookuptableLook-uptablefornon-lineartemperaturecompensationentryforredLEDiswrittenwithincreasingvaluesfromLUTAddress10toLUTAddress0.
Figure8showstheexampleofthetableforeachentry.
LookupTableAPIcommandneedtobewrittenintomicrocontrollersourcecodemaininterfacerightafterINITstripcommand.
Duringdebuggingmode,thissourcecodewillneedtobeflashedintoMCUmemorytooperateasusual.
ThesesettingwillmanuallyoverwrittenthelinearcompensationTC_BASEandTC_OFFSETvaluespre-recordedintheOTPoftheseddLED3.
0.
APIcommand(referencetoNXPS32Kxxseries):digLED_ReturnTypedigLED_Set_TC_Lookup(uint16_tLUT_Adr,uint16_tLUT_Value,uint16_tAddress,uint8_tStripNr);@paramLUT_Adr0-10:4-bitlook-uptableentry(address)@paramLUT_Value0-511:9-bitlook-uptablevalue,inincreasingvalues@paramAddress0-4079:AddressofthetargetLED.
0addressesallLEDsofthechain.
@paramStripNrNumberofthestriponwhichthecommandswillbesent1317.
08.
2020Ver(A)seddLED3.
0ApplicationNotesFigure8:Non-lineartemperaturecompensationlook-uptableentryThese11valueswillnotstorepermanentlyintheOTPandneedtobesetagainbythehostaftereveryreset.
BelowstepsgiveanexamplecommandsfortheINITofthestripandhowtosetthese11valueswiththeNXPMCU.
TheINITcommandmayonlybeexecutedafterpower-uporhardwareresetorafteraCAL_RESETcommandhasbeenexecuted.
Otherwiseitisconsideredanillegalcommandandtheundefinedcommanderrorstatusbitisset,ifanINITcommandisencountered.
1.
ResetseddLED3.
0LEDstrip2.
INITofLEDstripwithexampleofNXPdigLED_Init_StripcommandExampleUsage:uint32_tnrOfLEDs=10;digLEDResultStrip1.
chainLength=nrOfLEDs;digLED_InitStrip(&testInitType,&digLEDResultStrip1,STRIP1);delay(100000);appState=OPERATION_ONGOING;digLED_Init_Strip(&testInitType,&digLEDResultStrip1,strip);while(appState==OPERATION_ONGOING);delay(100000);1417.
08.
2020Ver(A)seddLED3.
0ApplicationNotes3.
Set11valuesofnon-linearlook-uptablewithexampleofNXPdigLED_Set_TC_LookupcommandappState=OPERATION_ONGOING;digLED_Set_TC_Lookup(0,511,1,0);//105Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(1,482,1,0);//100Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(2,380,1,0);//85Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(3,370,1,0);//65Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(4,320,1,0);//55Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(5,300,1,0);//45Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(6,295,1,0);//35Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(7,290,1,0);//25Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(8,285,1,0);//0Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(9,280,1,0);//-20Cwhile(appState==OPERATION_ONGOING);appState=OPERATION_ONGOING;digLED_Set_TC_Lookup(10,270,1,0);//-40Cwhile(appState==OPERATION_ONGOING);PleaserefertorespectiveMCUsupplierfortheAPIcommandifdifferentMCUisused.
However,thenon-lineartemperaturecompensationlook-uptableentry(figure8)willremainthesame.
1517.
08.
2020Ver(A)seddLED3.
0ApplicationNotes3.
0.
SurfaceMountingGuideline3.
1A3A-FKGPackageOutlineFigure9:A3A-FKGPackageOutline1617.
08.
2020Ver(A)seddLED3.
0ApplicationNotes3.
2StandardSolderingProcess:TheseddLED3.
0packagesolderingsurfacesareplatedwithgold(Au)andarethereforeRoHscompliant.
ThecomponentisdesignedtobecompatibletotheexistingindustrySMTprocessandIR-reflow.
Asforthesolderingprocess,thecomponentisqualifiedforPb-freesolderingprofile.
Theprofilesareasperdescribedinthedatasheet.
Figure10:RecommendedReflowSolderingProfileProfileFeatureSymbolPb-FreeAssemblyUnitMinimumRecommendedMaximumRamp-upratetopreheat25°CtoTsmin23°C/sTimetS,TsmintoTsmaxtS60100120sRamp-upratetopeak,TLtoTP23°C/sLiquidoustemperatureTL217°CTimeaboveliquidoustemperaturet6080150sPeaktemperatureTP245260°CTimewithin5°CofthespecifiedpeaktemperatureTP-5°CtP102030sRamp-downrate,TPto100°C36°C/sTime25°CtoTP480s1717.
08.
2020Ver(A)seddLED3.
0ApplicationNotes3.
3SurfaceMounting–FactorstoConsider:ThisapplicationnoteprovidesaguidelineforthesurfacemountingofseddLED3.
0.
Thefollowingparametershavetobeconsideredinordertooptimizethesurfacemountingperformance.
SolderpadsizeSolderstencilsizeSolderpastethicknessNozzleSolderqualitycheckSolderPadSizeTherecommendedsolderpaddesignisasillustratedinthedata-sheet.
Figure3:Recommendedsolderpadsize1817.
08.
2020Ver(A)seddLED3.
0ApplicationNotesSolderStencilSizeInordertominimizesolderbridgingproblems,itiscommontodesignstencilaperturesizesmallerthantherecommendedsolderpad.
Excessiveamountofsolderpastedeployedwillresulttotiltedpartsandinaccurateplacementposition.
Itisrecommendedthattheapertureisreducedto80%oftherecommendedsolderpaddesign.
Figure11:RecommendedsolderstencilsizeSolderPasteThicknessWerecommendusingminimumsolderpasteinordertoachieveagoodsolderformation.
Asolderpastethicknessof0.
125mmwillbeoptimum.
1917.
08.
2020Ver(A)seddLED3.
0ApplicationNotesNozzlePickandplacemachineshouldbeabletoprocessseddLED3.
0deviceswiththerequiredplacementaccuracy.
CareshouldbeobservedthatthesurfaceofthenozzlewhichisincontactwiththeLEDisflatandsmooth.
PickupareashouldbeobservedforthisseddLED3.
0asshowninFigure12.
ParametersettingsforthepickandplaceprocessshouldalsobeevaluatedtoensurenodamagetotheLEDs.
Forrecommendednozzledesign,pleaserefertoourRecommendedPickandPlaceToolsforLEDsfromDOMINANTOptoTechnologiesapplicationnote.
Figure12:RecommendednozzlesizeandpickupareaSolderQualityCheckafterSMTProcessForseddLED3.
0,theprimarysolderingsurfacesareatthebottomandsideoftheLEDcomponent.
ThesolderfilletcanbeobservedeasilyatthesideoftheLEDpackage.
PackageSideView1PackageSideView2Figure13:Exampleofgoodsolderformationonlead2017.
08.
2020Ver(A)seddLED3.
0ApplicationNotesSolderPasteTypeDominanthastestedtheSAC305solderpastewithsatisfactoryresults.
However,sinceapplicationenvironmentsvarywidely,werecommendthatcustomersperformtheirownsolderpasteevaluationinordertoensureitissuitableforthetargetedapplication.
StorageMethodafterSMTForPCBassemblythatmountedwithseddLED3.
0,itshouldnotbestacktogetherafterIRreflow,elseitwouldhavehighchanceofdamagingtheLED.
RecommendedmethodishavingadedicatedcarriersothateachPCBassemblyiswithatleast5mmawayfromeachother.
Figure14:ExampleofcarriertostoretheLEDHandlingPrecautions1.
Mechanicalforcesexertedontotheblacksiliconeovercoatarea(bottomview)ofseddLED3.
0shouldbeminimized.
BlackSiliconeOvercoat2117.
08.
2020Ver(A)seddLED3.
0ApplicationNotesFigure15:BottomviewofseddLED3.
02.
Formanualhandling,anti-static/conductiveplastictweezersshouldbeusetopickupseddLED3.
0.
Avoidtouchingsensitiveareasuchasthepackagelead,LESandblacksiliconeovercoatareaduringpickup.
Figure16:ExampleofcorrectandwrongmethodonLEDhandling3.
AbetteralternativeformanualhandlingofseddLED3.
0packageisusingvacuumsuctionpen.
Thesuctiontipshouldbemadeofasoftmaterialsuchasrubbertominimizethemechanicalforceexertedontosensitivearea.
CareshouldbetakentoavoidthesoftmaterialfromcontaminatingthetopsidesurfaceoftheLEDemittingarea.
Figure17:Exampleofvacuumsuctionpen2217.
08.
2020Ver(A)seddLED3.
0ApplicationNotes4.
RevisionHistoryChangesDateInitialRelease15Jan2019UpdatedNXPMCUdetailAddedMicrochipdetailRemoveNXPsoftwaredriveinstallationanddemoguide(duplicatefromseddLEDdemokituserguide)AddedTemperatureCompensationexplanationandapplicationguideAddedSMThandlingandguideline17Aug2020