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APT75DL120HJAPT75DL120HJ–Rev1Otober,2012www.
microsemi.
com1-4AbsolutemaximumratingsSymbolParameterMaxratingsUnitVRMaximumDCreverseVoltageVRRMMaximumPeakRepetitiveReverseVoltage1200VIF(AV)MaximumAverageForwardCurrentDutycycle=50%TC=80°C75IFRMMaximumrepetitiveforwardcurrentlimitedbyTJmax8.
3msTJ=45°C150ATheseDevicesaresensitivetoElectrostaticDischarge.
ProperHandlingProceduresShouldBeFollowed.
SeeapplicationnoteAPT0502onwww.
microsemi.
comVRRM=1200VIF=75A@Tc=80°CApplicationSwitchmodepowersuppliesrectifierInductionheatingWeldingequipmentHighspeedrectifiersFeaturesUltrafastrecoverytimesSoftrecoverycharacteristicsHighblockingvoltageHighcurrentLowleakagecurrentVerylowstrayinductanceHighlevelofintegrationISOTOPPackage(SOT-227)BenefitsOutstandingperformanceathighfrequencyoperationLowlossesLownoiseswitchingDirectmountingtoheatsink(isolatedpackage)LowjunctiontocasethermalresistanceRoHSCompliantISOTOPFastDiodeFullBridgePowerModule~~-+APT75DL120HJAPT75DL120HJ–Rev1Otober,2012www.
microsemi.
com2-4Allratings@Tj=25°CunlessotherwisespecifiedElectricalCharacteristicsSymbolCharacteristicTestConditionsMinTypMaxUnitTj=25°C1.
62.
1VFDiodeForwardVoltageIF=75ATj=125°C1.
6VTj=25°C250IRMMaximumReverseLeakageCurrentVR=1200VTj=125°C500ADynamicCharacteristicsSymbolCharacteristicTestConditionsMinTypMaxUnitTj=25°C170trrReverseRecoveryTimeTj=125°C280nsTj=25°C7QrrReverseRecoveryChargeTj=125°C14CTj=25°C3ErrReverseRecoveryEnergyIF=75AVR=600Vdi/dt=2000A/sTj=125°C5.
5mJThermalandpackagecharacteristicsSymbolCharacteristicMinTypMaxUnitRthJCJunctiontoCaseThermalresistance0.
58RthJAJunctiontoAmbient20°C/WVISOLRMSIsolationVoltage,anyterminaltocaset=1min,50/60Hz2500VTJ,TSTGStorageTemperatureRange-55150TLMaxLeadTempforSoldering:0.
063"fromcasefor10sec300°CTorqueMountingtorque(Mounting=8-32or4mmMachineandterminals=4mmMachine)1.
5N.
mWtPackageWeight29.
2gSOT-227(ISOTOP)PackageOutline31.
5(1.
240)31.
7(1.
248)DimensionsinMillimetersand(Inches)7.
8(.
307)8.
2(.
322)30.
1(1.
185)30.
3(1.
193)38.
0(1.
496)38.
2(1.
504)14.
9(.
587)15.
1(.
594)11.
8(.
463)12.
2(.
480)8.
9(.
350)9.
6(.
378)HexNutM4(4places)0.
75(.
030)0.
85(.
033)12.
6(.
496)12.
8(.
504)25.
2(0.
992)25.
4(1.
000)1.
95(.
077)2.
14(.
084)r=4.
0(.
157)(2places)4.
0(.
157)4.
2(.
165)(2places)W=4.
1(.
161)W=4.
3(.
169)H=4.
8(.
187)H=4.
9(.
193)(4places)3.
3(.
129)3.
6(.
143)3.
30(.
130)4.
57(.
180)APT75DL120HJAPT75DL120HJ–Rev1Otober,2012www.
microsemi.
com3-4TypicalPerformanceCurveEnergylossesvsCollectorCurrent02.
557.
50255075100125150IF(A)Err(mJ)VCE=600VVGE=-15VTJ=125°CForwardCharacteristicofdiodeTJ=25°CTJ=125°CTJ=125°C025507510012515000.
40.
81.
21.
622.
4VF(V)IF(A)maximumEffectiveTransientThermalImpedance,JunctiontoCasevsPulseDuration0.
90.
70.
50.
30.
10.
05SinglePulse00.
10.
20.
30.
40.
50.
60.
000010.
00010.
0010.
010.
1110rectangularPulseDuration(Seconds)ThermalImpedance(°C/W)ISOTOPisaregisteredtrademarkofSTMicroelectronicsNVAPT75DL120HJAPT75DL120HJ–Rev1Otober,2012www.
microsemi.
com4-4DISCLAIMERTheinformationcontainedinthedocument(unlessitispubliclyavailableontheWebwithoutaccessrestrictions)isPROPRIETARYANDCONFIDENTIALinformationofMicrosemiandcannotbecopied,published,uploaded,posted,transmitted,distributedordisclosedorusedwithouttheexpressdulysignedwrittenconsentofMicrosemi.
IftherecipientofthisdocumenthasenteredintoadisclosureagreementwithMicrosemi,thenthetermsofsuchAgreementwillalsoapply.
Thisdocumentandtheinformationcontainedhereinmaynotbemodified,byanypersonotherthanauthorizedpersonnelofMicrosemi.
Nolicenseunderanypatent,copyright,tradesecretorotherintellectualpropertyrightisgrantedtoorconferreduponyoubydisclosureordeliveryoftheinformation,eitherexpressly,byimplication,inducement,estoppelsorotherwise.
AnylicenseundersuchintellectualpropertyrightsmustbeapprovedbyMicrosemiinwritingsignedbyanofficerofMicrosemi.
Microsemireservestherighttochangetheconfiguration,functionalityandperformanceofitsproductsatanytimewithoutanynotice.
Thisproducthasbeensubjecttolimitedtestingandshouldnotbeusedinconjunctionwithlife-supportorothermission-criticalequipmentorapplications.
Microsemiassumesnoliabilitywhatsoever,andMicrosemidisclaimsanyexpressorimpliedwarranty,relatingtosaleand/oruseofMicrosemiproductsincludingliabilityorwarrantiesrelatingtofitnessforaparticularpurpose,merchantability,orinfringementofanypatent,copyrightorotherintellectualpropertyright.
Anyperformancespecificationsbelievedtobereliablebutarenotverifiedandcustomerorusermustconductandcompleteallperformanceandothertestingofthisproductaswellasanyuserorcustomersfinalapplication.
UserorcustomershallnotrelyonanydataandperformancespecificationsorparametersprovidedbyMicrosemi.
Itisthecustomer'sanduser'sresponsibilitytoindependentlydeterminesuitabilityofanyMicrosemiproductandtotestandverifythesame.
Theinformationcontainedhereinisprovided"ASIS,WHEREIS"andwithallfaults,andtheentireriskassociatedwithsuchinformationisentirelywiththeUser.
Microsemispecificallydisclaimsanyliabilityofanykindincludingforconsequential,incidentalandpunitivedamagesaswellaslostprofit.
Theproductissubjecttoothertermsandconditionswhichcanbelocatedonthewebathttp://www.
microsemi.
com/legal/tnc.
aspLifeSupportApplicationSeller'sProductsarenotdesigned,intended,orauthorizedforuseascomponentsinsystemsintendedforspace,aviation,surgicalimplantintothebody,inotherapplicationsintendedtosupportorsustainlife,orforanyotherapplicationinwhichthefailureoftheSeller'sProductcouldcreateasituationwherepersonalinjury,deathorpropertydamageorlossmayoccur(collectively"LifeSupportApplications").
BuyeragreesnottouseProductsinanyLifeSupportApplicationsandtotheextentitdoesitshallconductextensivetestingoftheProductinsuchapplicationsandfurtheragreestoindemnifyandholdSeller,anditsofficers,employees,subsidiaries,affiliates,agents,salesrepresentativesanddistributorsharmlessagainstallclaims,costs,damagesandexpenses,andattorneys'feesandcostsarising,directlyordirectly,outofanyclaimsofpersonalinjury,death,damageorotherwiseassociatedwiththeuseofthegoodsinLifeSupportApplications,evenifsuchclaimincludesallegationsthatSellerwasnegligentregardingthedesignormanufactureofthegoods.
BuyermustnotifySellerinwritingbeforeusingSeller'sProductsinLifeSupportApplications.
SellerwillstudywithBuyeralternativesolutionstomeetBuyerapplicationspecificationbasedonSellerssalesconditionsapplicableforthenewproposedspecificpart.
microsemi.
com1-4AbsolutemaximumratingsSymbolParameterMaxratingsUnitVRMaximumDCreverseVoltageVRRMMaximumPeakRepetitiveReverseVoltage1200VIF(AV)MaximumAverageForwardCurrentDutycycle=50%TC=80°C75IFRMMaximumrepetitiveforwardcurrentlimitedbyTJmax8.
3msTJ=45°C150ATheseDevicesaresensitivetoElectrostaticDischarge.
ProperHandlingProceduresShouldBeFollowed.
SeeapplicationnoteAPT0502onwww.
microsemi.
comVRRM=1200VIF=75A@Tc=80°CApplicationSwitchmodepowersuppliesrectifierInductionheatingWeldingequipmentHighspeedrectifiersFeaturesUltrafastrecoverytimesSoftrecoverycharacteristicsHighblockingvoltageHighcurrentLowleakagecurrentVerylowstrayinductanceHighlevelofintegrationISOTOPPackage(SOT-227)BenefitsOutstandingperformanceathighfrequencyoperationLowlossesLownoiseswitchingDirectmountingtoheatsink(isolatedpackage)LowjunctiontocasethermalresistanceRoHSCompliantISOTOPFastDiodeFullBridgePowerModule~~-+APT75DL120HJAPT75DL120HJ–Rev1Otober,2012www.
microsemi.
com2-4Allratings@Tj=25°CunlessotherwisespecifiedElectricalCharacteristicsSymbolCharacteristicTestConditionsMinTypMaxUnitTj=25°C1.
62.
1VFDiodeForwardVoltageIF=75ATj=125°C1.
6VTj=25°C250IRMMaximumReverseLeakageCurrentVR=1200VTj=125°C500ADynamicCharacteristicsSymbolCharacteristicTestConditionsMinTypMaxUnitTj=25°C170trrReverseRecoveryTimeTj=125°C280nsTj=25°C7QrrReverseRecoveryChargeTj=125°C14CTj=25°C3ErrReverseRecoveryEnergyIF=75AVR=600Vdi/dt=2000A/sTj=125°C5.
5mJThermalandpackagecharacteristicsSymbolCharacteristicMinTypMaxUnitRthJCJunctiontoCaseThermalresistance0.
58RthJAJunctiontoAmbient20°C/WVISOLRMSIsolationVoltage,anyterminaltocaset=1min,50/60Hz2500VTJ,TSTGStorageTemperatureRange-55150TLMaxLeadTempforSoldering:0.
063"fromcasefor10sec300°CTorqueMountingtorque(Mounting=8-32or4mmMachineandterminals=4mmMachine)1.
5N.
mWtPackageWeight29.
2gSOT-227(ISOTOP)PackageOutline31.
5(1.
240)31.
7(1.
248)DimensionsinMillimetersand(Inches)7.
8(.
307)8.
2(.
322)30.
1(1.
185)30.
3(1.
193)38.
0(1.
496)38.
2(1.
504)14.
9(.
587)15.
1(.
594)11.
8(.
463)12.
2(.
480)8.
9(.
350)9.
6(.
378)HexNutM4(4places)0.
75(.
030)0.
85(.
033)12.
6(.
496)12.
8(.
504)25.
2(0.
992)25.
4(1.
000)1.
95(.
077)2.
14(.
084)r=4.
0(.
157)(2places)4.
0(.
157)4.
2(.
165)(2places)W=4.
1(.
161)W=4.
3(.
169)H=4.
8(.
187)H=4.
9(.
193)(4places)3.
3(.
129)3.
6(.
143)3.
30(.
130)4.
57(.
180)APT75DL120HJAPT75DL120HJ–Rev1Otober,2012www.
microsemi.
com3-4TypicalPerformanceCurveEnergylossesvsCollectorCurrent02.
557.
50255075100125150IF(A)Err(mJ)VCE=600VVGE=-15VTJ=125°CForwardCharacteristicofdiodeTJ=25°CTJ=125°CTJ=125°C025507510012515000.
40.
81.
21.
622.
4VF(V)IF(A)maximumEffectiveTransientThermalImpedance,JunctiontoCasevsPulseDuration0.
90.
70.
50.
30.
10.
05SinglePulse00.
10.
20.
30.
40.
50.
60.
000010.
00010.
0010.
010.
1110rectangularPulseDuration(Seconds)ThermalImpedance(°C/W)ISOTOPisaregisteredtrademarkofSTMicroelectronicsNVAPT75DL120HJAPT75DL120HJ–Rev1Otober,2012www.
microsemi.
com4-4DISCLAIMERTheinformationcontainedinthedocument(unlessitispubliclyavailableontheWebwithoutaccessrestrictions)isPROPRIETARYANDCONFIDENTIALinformationofMicrosemiandcannotbecopied,published,uploaded,posted,transmitted,distributedordisclosedorusedwithouttheexpressdulysignedwrittenconsentofMicrosemi.
IftherecipientofthisdocumenthasenteredintoadisclosureagreementwithMicrosemi,thenthetermsofsuchAgreementwillalsoapply.
Thisdocumentandtheinformationcontainedhereinmaynotbemodified,byanypersonotherthanauthorizedpersonnelofMicrosemi.
Nolicenseunderanypatent,copyright,tradesecretorotherintellectualpropertyrightisgrantedtoorconferreduponyoubydisclosureordeliveryoftheinformation,eitherexpressly,byimplication,inducement,estoppelsorotherwise.
AnylicenseundersuchintellectualpropertyrightsmustbeapprovedbyMicrosemiinwritingsignedbyanofficerofMicrosemi.
Microsemireservestherighttochangetheconfiguration,functionalityandperformanceofitsproductsatanytimewithoutanynotice.
Thisproducthasbeensubjecttolimitedtestingandshouldnotbeusedinconjunctionwithlife-supportorothermission-criticalequipmentorapplications.
Microsemiassumesnoliabilitywhatsoever,andMicrosemidisclaimsanyexpressorimpliedwarranty,relatingtosaleand/oruseofMicrosemiproductsincludingliabilityorwarrantiesrelatingtofitnessforaparticularpurpose,merchantability,orinfringementofanypatent,copyrightorotherintellectualpropertyright.
Anyperformancespecificationsbelievedtobereliablebutarenotverifiedandcustomerorusermustconductandcompleteallperformanceandothertestingofthisproductaswellasanyuserorcustomersfinalapplication.
UserorcustomershallnotrelyonanydataandperformancespecificationsorparametersprovidedbyMicrosemi.
Itisthecustomer'sanduser'sresponsibilitytoindependentlydeterminesuitabilityofanyMicrosemiproductandtotestandverifythesame.
Theinformationcontainedhereinisprovided"ASIS,WHEREIS"andwithallfaults,andtheentireriskassociatedwithsuchinformationisentirelywiththeUser.
Microsemispecificallydisclaimsanyliabilityofanykindincludingforconsequential,incidentalandpunitivedamagesaswellaslostprofit.
Theproductissubjecttoothertermsandconditionswhichcanbelocatedonthewebathttp://www.
microsemi.
com/legal/tnc.
aspLifeSupportApplicationSeller'sProductsarenotdesigned,intended,orauthorizedforuseascomponentsinsystemsintendedforspace,aviation,surgicalimplantintothebody,inotherapplicationsintendedtosupportorsustainlife,orforanyotherapplicationinwhichthefailureoftheSeller'sProductcouldcreateasituationwherepersonalinjury,deathorpropertydamageorlossmayoccur(collectively"LifeSupportApplications").
BuyeragreesnottouseProductsinanyLifeSupportApplicationsandtotheextentitdoesitshallconductextensivetestingoftheProductinsuchapplicationsandfurtheragreestoindemnifyandholdSeller,anditsofficers,employees,subsidiaries,affiliates,agents,salesrepresentativesanddistributorsharmlessagainstallclaims,costs,damagesandexpenses,andattorneys'feesandcostsarising,directlyordirectly,outofanyclaimsofpersonalinjury,death,damageorotherwiseassociatedwiththeuseofthegoodsinLifeSupportApplications,evenifsuchclaimincludesallegationsthatSellerwasnegligentregardingthedesignormanufactureofthegoods.
BuyermustnotifySellerinwritingbeforeusingSeller'sProductsinLifeSupportApplications.
SellerwillstudywithBuyeralternativesolutionstomeetBuyerapplicationspecificationbasedonSellerssalesconditionsapplicableforthenewproposedspecificpart.
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